From 048df61d4e45456300b463a1386a08350be07c37 Mon Sep 17 00:00:00 2001
From: CloverGit <w991593239@163.com>
Date: Tue, 20 Jul 2021 13:37:38 +0800
Subject: [PATCH] Update Chinese Translation

---
 content/footprint/F1/F1.1.adoc   | 24 ++++++++--------
 content/footprint/F1/F1.2.adoc   | 18 ++++++------
 content/footprint/F1/_index.adoc |  4 +--
 content/footprint/F2/F2.1.adoc   | 42 ++++++++++++++--------------
 content/footprint/F2/F2.2.adoc   | 24 ++++++++--------
 content/footprint/F2/F2.4.adoc   | 34 +++++++++++-----------
 content/footprint/F2/F2.5.adoc   |  6 ++--
 content/footprint/F2/_index.adoc |  4 +--
 content/footprint/F3/F3.1.adoc   | 18 ++++++------
 content/footprint/F3/F3.2.adoc   |  6 ++--
 content/footprint/F3/F3.3.adoc   | 40 +++++++++++++-------------
 content/footprint/F3/F3.4.adoc   | 48 ++++++++++++++++----------------
 content/footprint/F3/F3.5.adoc   | 36 ++++++++++++------------
 content/footprint/F3/F3.7.adoc   | 18 ++++++------
 content/footprint/F3/_index.adoc |  4 +--
 content/footprint/F4/F4.1.adoc   |  8 +++---
 content/footprint/F4/F4.2.adoc   | 16 +++++------
 content/footprint/F4/F4.3.adoc   | 10 +++----
 content/footprint/F4/F4.5.adoc   | 14 +++++-----
 content/footprint/F4/_index.adoc |  4 +--
 content/footprint/F5/_index.adoc |  4 +--
 21 files changed, 192 insertions(+), 190 deletions(-)

diff --git a/content/footprint/F1/F1.1.adoc b/content/footprint/F1/F1.1.adoc
index c2c9e98..feebd6f 100644
--- a/content/footprint/F1/F1.1.adoc
+++ b/content/footprint/F1/F1.1.adoc
@@ -1,22 +1,22 @@
 +++
-title = "F1.1 Footprint libraries are categorized by function"
+title = "F1.1 根据功能分组"
 +++
 
-Footprints are grouped into libraries (directories with `.pretty` extension) based on their primary function. As an extension of this, footprint libraries should be named based on this same functionality.
+封装根据其主要功能进行分组并保存到相应的库中 (扩展后缀为 `.pretty` 的目录)。处于同一封装库目录下的封装，功能也应当统一。
 
-Library names must be defined based on the priority list below, with each element separated by the underscore (`_`) character:
+库名称必须根据下面的优先级列表定义，参数之间以下划线 (`_`) 进行分隔。
 
-. Function (e.g. `Conn`, `Capacitor`)
-. Sub-function (e.g. `HDMI`, `USB`)
+. 功能 (例如 `Conn`, `Capacitor`)
+. 子功能 (例如 `HDMI`, `USB`)
 . Tertiary qualifier (e.g. `RightAngle`, `SMD`)
-. Manufacturer name (e.g. `Texas`, `Microchip`)
+. 制造商 (例如 `Texas`, `Microchip`)
 . Footprint series name (e.g. `MicroFit`)
-. Extra library descriptors as required
+. 其他需要额外增加的库描述字段
 
-_Note: Some of the elements listed above may be omitted if not required._
+_注意: 如果不需要，上面所列出的某些字段参数可以省略。_
 
-Example footprint library names:
+封装库命名示例:
 
-* `Conn_USB_SMD` - Surface mount USB connectors
-* `Conn_Molex_MicroFit` - Molex MicroFit series rectangular connectors
-* `Capacitor_Tantalum_SMD` - Surface mount Tantalum capacitors
\ No newline at end of file
+* `Conn_USB_SMD` - 表面贴片型 USB 连接器
+* `Conn_Molex_MicroFit` - Molex MicroFit 系列矩形连接器
+* `Capacitor_Tantalum_SMD` - 表面贴片型钽电容
diff --git a/content/footprint/F1/F1.2.adoc b/content/footprint/F1/F1.2.adoc
index 7701686..687d759 100644
--- a/content/footprint/F1/F1.2.adoc
+++ b/content/footprint/F1/F1.2.adoc
@@ -1,24 +1,24 @@
 +++
-title = "F1.2 Connector footprint libraries"
+title = "F1.2 连接器的封装库命名规范"
 +++
 
-Categorizing connectors _by function_ can prove difficult as many connectors can be used in a wide variety of applications.
+由于有着种类繁多的连接器被应用于各种各样不同的场合，可能很难根据 "功能" 对其分组。
 
-Therefore, categorization of connector footprints is given special consideration as detailed below:
+因此，对连接器的分类进行了特殊的考虑，详细如下:
 
-. Connectors are grouped firstly by their _primary function_ (where such a function exists). Examples of _primary function_ include:
+. 连接器首先按照其 _主要功能_ (若存在) 进行分组。按 _主要功能_ 分组示例如下:
 
 * `Conn_USB`
 * `Conn_HDMI`
 * `Conn_Ethernet`
 
 [start=2]
-. When primary function libraries become too large, they can be split by sub-function or by manufacturer
+. 当主要功能所囊括的范围太大无法作为分组依据时，可以按照其子功能或制造商进行分隔:
 
 * `Conn_USB_Molex`
 * `Conn_DSUB_HighDensity`
 
-. For connectors without a specific function, then connectors are grouped by their _mechanical type_:
+. 对于没有特定功能的连接器，则按照其 _机械类型_ 进行分组:
 
 * `Conn_Barrel`
 * `Conn_DIN`
@@ -27,14 +27,14 @@ Therefore, categorization of connector footprints is given special consideration
 * `Conn_PinSocket`
 * `Conn_Rectangular`
 
-. Connector libraries can be further split by another qualifier:
+. 连接器可以根据另一限定符进一步拆分:
 * `Conn_PinHeader_2.54mm`
 * `Conn_PinHeader_1.27mm`
 
-. Connector libraries can also be split by manufacturer and series, _for multi-purpose connectors_
+. 连接器也可以按照制造商和系列进行拆分，_主要针对多应用场合的连接器_:
 
 * `TerminalBlock_Phoenix_MKDS`
 * `TerminalBlock_Phoenix_PT`
 * `TerminalBlock_Wago`
 * `Conn_JST`
-* `Conn_Hirose_DF13`
\ No newline at end of file
+* `Conn_Hirose_DF13`
diff --git a/content/footprint/F1/_index.adoc b/content/footprint/F1/_index.adoc
index 268ff83..9f7bb2f 100644
--- a/content/footprint/F1/_index.adoc
+++ b/content/footprint/F1/_index.adoc
@@ -1,3 +1,3 @@
 ---
-title: F1 Footprint Libraries
----
\ No newline at end of file
+title: F1 封装库
+---
diff --git a/content/footprint/F2/F2.1.adoc b/content/footprint/F2/F2.1.adoc
index 6b87962..c2c46e7 100644
--- a/content/footprint/F2/F2.1.adoc
+++ b/content/footprint/F2/F2.1.adoc
@@ -1,43 +1,43 @@
 +++
-title = "F2.1 General footprint naming conventions"
+title = "F2.1 封装命名通用参考规范"
 +++
 
-Each footprint is a `.kicad_mod` file (stored within a `.pretty` directory). The naming convention for a given footprint depends largely on the _type_ of footprint, however a general guide is presented below:
+每一个封装都是一个 `.kicad_mod` 文件 (存储在 `.pretty` 目录中)。命名规范主要取决于封装 _类型_，下面提供了一份通用参考:
 
-. Specific package type is written first, e.g.
-  * `QFN` - Quad Flat No-Lead package
-  * `C` - Capacitor
-. Package name and number of pins are separated by a hyphen
+. 特殊的封装类型放在前面，例如:
+  * `QFN` - 方形扁平无引脚封装
+  * `C` - 电容
+. 封装名称与引脚数之间使用连字符 (`-`) 隔开:
   * `TO-90`
   * `QFN-48`
   * `DIP-20`
-. Packages with special pads add an identifier to the pin count field separated by a hyphen
-  * The field includes the count of uniquely numbered pads of this type.
-  ** For exposed pads (large copper pad below the part) `[count]EP`
-  ** For shield pads `[count]SH` (Unless such a pin is already expected for the part. An example would be a HDMI connector.)
-  ** For pads connecting pure mechanical mounting leads `[count]MP`
-  * Examples from the library.
+. 带特殊焊盘的封装，将特殊焊盘的标识字段放到引脚数字段之后，并用连字符 (`-`) 隔开，标识字段要求如下:
+  * 该字段需包含不同类型的特殊焊盘的数目 `[count]`
+  ** `[count]EP` - 针对热焊盘的命名格式 (器件底部的散热焊盘) 
+  ** `[count]SH` - 针对屏蔽外壳的命名格式 (Unless such a pin is already expected for the part. An example would be a HDMI connector.)
+  ** `[count]MP` - 仅用于安装或者固定器件的焊盘的命名格式
+  * 示例如下:
   ** `DFN-6-1EP_2x2mm_P0.5mm_EP0.61x1.42mm`
   ** `Samtec_LSHM-110-xx.x-x-DV-S_2x10-1SH_P0.50mm_Vertical`
   ** `Molex_PicoBlade_53261-0271_1x02-1MP_P1.25mm_Horizontal`
-. Unique _fields_ (parameters) in the footprint name are separated by `_` character.
-. Package dimensions are specified as `length` x `width` (and optionally `height`)
+. 封装名称中独立的 _字段_ (参数) 使用连字符 (`-`) 隔开。
+. 封装尺寸统一使用 `长度` x `宽度` 的格式 (`高度` 参数可选):
   * `3.5x3.5x0.2mm`
   * `1x1in`
-  * If necessary for clarity, footprint body dimensions may be prefixed with a leading `B`
-. Pin layout
+  * 为了使表达更加清晰明了，在必要的情况下可能会以字母 `B` 作为封装尺寸的前缀:
+. 管脚排布:
   * `1x10`
   * `2x15`
-. Pitch is specified with a leading `P`:
+. 器件的脚距以字母 `P` 作前缀:
   * `P1.27mm` - 1.27mm pitch
   * `P5.0mm` - 5.0mm pitch
-. Modifiers to standard footprint values
+. 封装仅在标准封装的基础上，对某些参数值进行了微调，需要如下注明:
   * `Drill1.25mm`
   * `Pad2.4x5.2mm`
-. Orientation e.g. `Horizontal`, `Vertical`
-. Any modification to the original footprint, indicated by appending the reason
+. 安装方向例如: `Horizontal`, `Vertical`
+. 对原始封装所做的任何修改，均以附加修改原因参数表示。
   * `_HandSoldering`
   * `_ThermalVias`
   * `_CircularHoles`
 
-Not all of the fields defined above are strictly required for a particular footprint. Additional fields may also be added as needed.
+对于某些特殊的封装，并非都是严格要求使用上面所定义的字段，可以根据需要添加其他字段。
diff --git a/content/footprint/F2/F2.2.adoc b/content/footprint/F2/F2.2.adoc
index 1713da9..9ac5581 100644
--- a/content/footprint/F2/F2.2.adoc
+++ b/content/footprint/F2/F2.2.adoc
@@ -1,28 +1,28 @@
 +++
-title = "F2.2 Footprint naming field prefixes"
+title = "F2.2 构成封装名称的字段及前缀"
 +++
 
-A footprint name has to convey a lot of information to clearly specify the purpose and parameters of the footprint. Some fields in footprint names are _common_ to many footprints and can be shortened using special abbreviations.
+封装名称必须包含大量信息以明确封装的用途和参数，其中的某些字段对于多数封装是 _通用_ 的，因此可以使用特殊缩写来缩短封装名称。
 
-Not all footprints will require the use of these abbreviations - they are provided as a method of standardising the manner in which footprint parameters are called out when encountered.
+并非所有封装都需要使用这些缩写 - 缩写作为标准化的参数，在元件有具体对应参数时进行调用。
 
-In many cases, the major dimensions (x/y/z) of a footprint may be specified without a prefix, as the body dimensions are assumed to have the greatest priority in the footprint name. Therefore, the "3.2x5.7mm" part of the example name below requires no 'B' prefix, and is not required to be written as "B3.2x5.7mm". 
+我们默认尺寸参数在封装名称中具有最高优先级，所以在多数情况下，封装的主体尺寸 (x/y/z) 可以在没有前缀的情况下指定。因此，下面示例命名中的 "3.2x5.7mm" 部分没有 'B' 前缀，也不需要写成 "B3.2x5.7mm"。
 
-e.g. `SOIC-8_3.2x5.7mm_P1.27mm`
+例如 `SOIC-8_3.2x5.7mm_P1.27mm`
 
-In cases where potential conflicts exist, however, the body dimensions must be explicitly named with the prefix `B`.
+但是，在存在潜在冲突的情况下，必须使用前缀 `B` 以明确地命名主体尺寸。
 
-Refer to the table below for accepted prefix abbreviations.
+可用的前缀缩写，请参阅下表。
 
 {{< fp_prefix >}}
 
-*Examples:*
+*示例:*
 
-* `LQFP-32_4x4x1.1mm_P1.65mm` - LQFP package, 32 pins, 4x4mm body, 1.1mm height, 1.65mm pitch
-* `CP_Radial_D4.5mm_P2.5mm_H10mm` - Radial polarized capacitor, 4.5mm diameter, 2.5mm pitch, 10mm height
+* `LQFP-32_4x4x1.1mm_P1.65mm` - LQFP 封装, 32 管脚, 4x4mm 主体尺寸, 1.1mm 高, 1.65mm 脚距
+* `CP_Radial_D4.5mm_P2.5mm_H10mm` - 有极性径向电容，4.5mm 直径，2.5mm 脚距，10mm 高
 
-If the parameter is not found in the table above, the name of the parameter should be entered in full.
+如果未在上表中找到所需的参数，则应输入该参数的完整名称。
 
-Following is a list of examples of (non-abbreviated) parameter names used in footprint naming
+以下是封装命名中使用的参数名称 (非缩写) 示例:
 
 {{< fp_prefix_long >}}
diff --git a/content/footprint/F2/F2.4.adoc b/content/footprint/F2/F2.4.adoc
index e9cb766..e5d4e24 100644
--- a/content/footprint/F2/F2.4.adoc
+++ b/content/footprint/F2/F2.4.adoc
@@ -1,37 +1,39 @@
 +++
-title = "F2.4 Footprint naming for non-standard pin numbering"
+title = "F2.4 非标准引脚编号方式的封装命名"
 +++
 
-Generally, a footprint should include a field of the format `<pkg>-<pincount>`, e.g.
+通常，在封装名称中会有格式 `<pkg>-<pincount>` 的字段，例如:
 
 * `SOIC-8`
 * `QFN-24`
 
-In the majority of cases, the pin quantity is self explanatory and is sufficient to describe the number of pins on the symbol.
+多数情况下，使用这种名称的封装，引脚数量是不言自明的
 
-However there may be cases where this numbering is insufficient. Where the number of footprint pins does not match the number of package pins, exceptions must be made.
+但是，可能会存在下面这种实际引脚数量比标准封装来得少的情况。如果实际器件封装的引脚数与库封装的引脚数不匹配，则必须另外处理。
 
-**Exception: Omitted pins, missing pin numbers are skipped** 
+**例外情况: 省略掉某些引脚，并跳过缺失的引脚编号** 
 
-_Example: LTC3638_
+_示例: LTC3638_
 
-The LTC3638 comes in an `MSOP-16` package which has four missing pins, for increased voltage isolation.
+LTC3638 采用 `MSOP-16` 封装，而为了提高电压隔离度，实际的芯片封装缺少4个引脚。
 
-{{< klcimg src="F2.4a" title="MSOP-16 package with 4 missing pins" >}}
+{{< klcimg src="F2.4a" title="缺少4个引脚的 MSOP-16 封装" >}}
 
-In this case, the numbers for the missing pins are *skipped* and the normal pin numbers are assigned to the remaining pins.
+在这种情况下，将 *跳过* 缺少编号的引脚，并将正常的引脚编号分配给剩余的引脚。
 
-To indicate this, the footprint should be named as follows:
+为了在封装名称中表明这一点，命名格式应如下:
 
-`PKG-<xx>-<yy>` where:
+`PKG-<xx>-<yy>`
 
-* `xx` = number of remaining pins
-* `yy` = number of remaining pins + number of removed pins
+其中:
 
-In the LTC3638 example above, this would result in:
+* `xx` = 实际的引脚数
+* `yy` = 实际的引脚数 + 缺失的引脚数
+
+在上面的 LTC3638 示例中，封装应该这样命名:
 
 `MSOP-12-16`
 
-The footprint pads should be numbered like so:
+封装焊盘则会像下面这样排布:
 
-{{< klcimg src="F2.4b" title="MSOP-12-16 footprint in KiCad" >}}
+{{< klcimg src="F2.4b" title="KiCad 中的 MSOP-12-16 封装" >}}
diff --git a/content/footprint/F2/F2.5.adoc b/content/footprint/F2/F2.5.adoc
index eda5ea2..88a9634 100644
--- a/content/footprint/F2/F2.5.adoc
+++ b/content/footprint/F2/F2.5.adoc
@@ -1,7 +1,7 @@
 +++
-title = "F2.5 Footprint naming conventions for specific components"
+title = "F2.5 特定器件的封装命名参考规范"
 +++
 
-Footprint naming is sufficiently complex that a general rule is not enough to fully define a naming scheme that fits the wide range of footprints.
+封装命名非常复杂，一份通用规则不足以完全适合并作为各种封装的命名方案。
 
-In addition to the general footprint naming guidelines defined in link:/footprint/F2.1/[KLC 2.1], a set of footprint naming guidelines for specific footprint types is provided in link:/footprint/F3[KLC F3.x].
\ No newline at end of file
+除了 link:/footprint/F2.1/[KLC 2.1] 中定义的一般封装命名指南外，在 link:/footprint/F3[KLC F3.x] 还提供了一组针对特定封装类型的命名指南。
diff --git a/content/footprint/F2/_index.adoc b/content/footprint/F2/_index.adoc
index 2f50bc9..e9a7c02 100644
--- a/content/footprint/F2/_index.adoc
+++ b/content/footprint/F2/_index.adoc
@@ -1,3 +1,3 @@
 ---
-title: F2 General Footprint Naming Guidelines
----
\ No newline at end of file
+title: F2 封装命名通用指南
+---
diff --git a/content/footprint/F3/F3.1.adoc b/content/footprint/F3/F3.1.adoc
index 445b042..b123c51 100644
--- a/content/footprint/F3/F3.1.adoc
+++ b/content/footprint/F3/F3.1.adoc
@@ -1,25 +1,25 @@
 +++
-title = "F3.1 SMD chip package naming conventions"
+title = "F3.1 SMD 贴片器件命名参考规范"
 +++
 
 {{< fp_naming_header type="SMD chip package" >}}
 
 {{< fp_code name="smd_chip" >}}
 
-Notes:
+注意:
 
-The prefix is determined by the default reference designator of the device, e.g.
+前缀根据器件的默认缩写名称来确定，例如:
 
-* Capacitor = `C`
-* Capacitor (polarised) = `CP`
-* Resistor = `R`
-* Diode = `D`
+* 电容 = `C`
+* 电容 (有极性) = `CP`
+* 电阻 = `R`
+* 二极管 = `D`
 
-Case size codes:
+尺寸代码:
 
 [.library]
 |===
-|Imperial Code|Metric Code|Size Imperial|Size Metric
+|英制代码|公制代码|英制尺寸|公制尺寸
 
 | 01005 | 0402 | 0.0157 in × 0.0079 in | 0.4 mm × 0.2 mm
 | 0201  | 0603 | 0.024 in × 0.012 in   | 0.6 mm × 0.3 mm
diff --git a/content/footprint/F3/F3.2.adoc b/content/footprint/F3/F3.2.adoc
index 05adfd1..48fb46d 100644
--- a/content/footprint/F3/F3.2.adoc
+++ b/content/footprint/F3/F3.2.adoc
@@ -1,9 +1,9 @@
 +++
-title = "F3.2 Resistor naming conventions"
+title = "F3.2 电阻命名参考规范"
 +++
 
 {{< fp_naming_header type="resistor" >}}
 
-== Axial Resistors
+== 轴向电阻 Axial Resistors
 
-{{< fp_code name="r_axial" >}}
\ No newline at end of file
+{{< fp_code name="r_axial" >}}
diff --git a/content/footprint/F3/F3.3.adoc b/content/footprint/F3/F3.3.adoc
index 4001895..b801934 100644
--- a/content/footprint/F3/F3.3.adoc
+++ b/content/footprint/F3/F3.3.adoc
@@ -1,19 +1,19 @@
 +++
-title = "F3.3 Capacitor naming conventions"
+title = "F3.3 电容命名参考规范"
 +++
 
 {{< fp_naming_header type="capacitor" >}}
 
-== SMD Chip Capacitor
+== 贴片电容 SMD Chip Capacitor
 
 {{< fp_code name="cap_chip" >}}
 
-Notes:
+注意:
 
-. At least one case size (either imperial or metric) must be specified
-. Metric case size must have the suffix `Metric`
+. 必须至少指定一种外壳尺寸 (英制或公制)
+. 使用公制尺寸的，必须加上 `Metic` 后缀
 
-== SMD Tantalum Capacitor
+== 贴片钽电容 SMD Tantalum Capacitor
 
 {{< fp_code name="cap_tant_smd" >}}
 
@@ -46,23 +46,23 @@ Notes:
 | 7361-438 | 7,3 x 6,1 x 4,3 mm   | — | U
 |===
 
-== SMD Electrolytic Capacitor
+== 贴片电解电容 SMD Electrolytic Capacitor
 
 {{< fp_code name="cap_elec_smd" >}}
 
-== THT Capacitor
+== 直插电容 THT Capacitor
 
 {{< fp_code name="cap_tht" >}}
 
-Notes:
-
-. There are different capacitor styles available:
-* Axial: Cylindrical body with axial lead attachment.
-* Radial: Cylindrical body, both leads enter at same end.
-* Disc: Disc shaped body (sometimes enclosed), leads enter tangent to the inner disc
-* Rect: Box shaped body (Bottom face in contact with the board)
-. Body size:
-* For Axial body styles: L[length]_D[diameter]
-* For Radial body style: D[diameter]{_H[height]}
-* For Disc body style: D[diameter]_W[width]{_H[overall height]}
-* For box shaped body styles: [X]x[Y]{x[Z]}
+注意:
+
+. 有不同的电容规格样式可供选择:
+* Axial: 轴向，两端带有轴向引线附件的圆柱体。
+* Radial: 径向，同一侧引出两根引线的圆柱体 (比如常见的直插电容)。
+* Disc: 扁平圆形，圆盘形状的主体外形Disc shaped body (sometimes enclosed), leads enter tangent to the inner disc (比如常见的瓷片电容)。
+* Rect: 矩形，盒状Box shaped body (Bottom face in contact with the board)。
+. 尺寸格式:
+* 对于轴向圆柱形电容 (Axial): L[长度]_D[直径]
+* 对于径向圆柱形电容 (Radial): D[直径]{_H[高度]}
+* 对于扁平圆盘形电容 (Disc): D[直径]_W[宽度]{_H[总高度]}
+* 对于盒状矩形的电容 (Rect): [X]x[Y]{x[Z]}
diff --git a/content/footprint/F3/F3.4.adoc b/content/footprint/F3/F3.4.adoc
index 269da3e..b9d91c4 100644
--- a/content/footprint/F3/F3.4.adoc
+++ b/content/footprint/F3/F3.4.adoc
@@ -1,14 +1,14 @@
 +++
-title = "F3.4 SMD IC package naming conventions"
+title = "F3.4 SMD 贴片 IC 封装命名参考规范"
 +++
 
 {{< fp_naming_header type="SMD IC package" >}}
 
-== Gullwing Packages
+== 鸥翼型封装 Gullwing Packages
 
-The format below provides a guide for naming Gullwing IC packages.
+下面提供了针对鸥翼型封装 (Gullwing Package) 的命名格式参考。
 
-Examples:
+示例:
 
 * SOIC
 * SOP
@@ -18,20 +18,20 @@ Examples:
 
 {{< fp_code name="ic_gull" >}}
 
-Notes:
+注意:
 
-. [`PKG`] - refers to the name most commonly used in the industry. Generally this implies JEDEC naming but some other standard may be used as required.
-. [`Pin count`] - the number of _uniquely numbered_ pads (excluding any exposed pads under the device)
-. [`Modifiers`] - may vary for individual IC footprint types. Includes:
+. [`PKG`] - 指该封装在行业内最常用的名称。一般会使用 JEDEC (一种常用的半导体封装标准) 中的命名，但也可以根据需要使用其它标准中的名称。
+. [`Pin count`] - 拥有_唯一编号_的焊盘数量 (不包括器件下方的裸露焊盘 (热焊盘))。
+. [`Modifiers`] - 该项具体参数因个别 IC 封装类型而异，根据具体情况添加。可能的参数包括:
 * Clearance
-* Lead size
-* Pad size
-* Exposed pad size
-* Soldermask expansion
+* 引脚尺寸 Lead size
+* 焊盘尺寸 Pad size
+* 裸露焊盘 (热焊盘) 尺寸 Exposed pad size
+* 阻焊层延伸量 Soldermask expansion
 
-== No-Lead Packages
+== 无引脚封装 No-Lead Packages
 
-Examples:
+示例:
 
 * DFN
 * QFN
@@ -39,20 +39,20 @@ Examples:
 
 {{< fp_code name="ic_dfn" >}}
 
-Notes:
+注意:
 
-. The lead length is the nominal lead length for which the footprint is designed
-. Optionally the nominal lead width can also be provided
+. 引脚长度指的该封装针对中等密度等级所设计的引脚长度。
+. 如果有需要，可以额外提供引脚宽度。
 
-== Ball Grid Array Packages
+== 球栅阵列封装 Ball Grid Array Packages
 
 {{< fp_code name="ic_bga" >}}
 
-Notes:
+注意:
 
-. For BGA simply providing the pin count is not sufficient. It is also necessary to provide the number of [`Columns`] (x direction) and [`Rows`] (y direction).
-. Some BGA packages have different pitch in x and y directions. If this is the case then both [`Pitch`] dimensions need to be provided
-. The [`Ball`] diameter for which the footprint is designed needs to be provided
+. 对于 BGA 封装来说，仅仅提供引脚数量是不够的，还需要提供 横向排列的引脚数 [`Columns`] 和 纵向排列的引脚数 [`Rows`]。
+. 一些 BGA 封装的 横向脚距 和 纵向脚距 是不一样的，如果遇到这种情况，两个脚距 [`Pitch`] 都必须提供。
+. 必须提供引脚球直径 [`Ball`]。
 . [`NSMD/SMD`]
-  * NSMD means the footprint is designed for `non solder mask defined` (mask cutout is larger than copper pad)
-  * SMD means the footprint is designed for `solder mask defined` (mask cutout is smaller than copper pad)
+  * NSMD 表示封装是为 `非阻焊层限定焊盘` 而设计的（阻焊开窗尺寸大于焊盘）。
+  * SMD 表示封装是为 `阻焊层限定焊盘` 而设计的（阻焊开窗尺寸小于焊盘）。
diff --git a/content/footprint/F3/F3.5.adoc b/content/footprint/F3/F3.5.adoc
index b90a7e3..a79cb4d 100644
--- a/content/footprint/F3/F3.5.adoc
+++ b/content/footprint/F3/F3.5.adoc
@@ -1,36 +1,36 @@
 +++
-title = "F3.5 THT IC package naming conventions"
+title = "F3.5 THT 直插 IC 封装命名参考规范"
 +++
 
 {{< fp_naming_header type="THT IC package" >}}
 
-== Through Hole Packages (DIP)
+== 双列直插封装 Dual In-line Packages (DIP)
 
 {{< fp_code name="ic_tht_dip" >}}
 
-Notes:
+注意:
 
-. Drill size (if specified) must be given in `mm`
+. 钻孔尺寸必须以毫米 `mm` 为单位 (除非另有规定)。
 
-== Through Hole Packages (TO)
+== 晶体管外形封装 Transistor Out-line Packages (TO)
 
 {{< fp_code name="ic_tht_to" >}}
 
-Notes:
+注意:
 
-. Drill size (if specified) must be given in `mm`
-. `Orientation` can be chosen from:
-* Vertical
-* TabDown
-* TabUp
-. `Stagger` can be chosen from:
-* StaggerOdd (odd pins are further from component body)
-* StaggerEven (even pins are further from component body)
+. 钻孔尺寸必须以毫米 `mm` 为单位 (除非另有规定)
+. 安装方向 `Orientation` 可以选择:
+* Vertical 垂直
+* TabDown 散热焊盘朝下
+* TabUp	散热焊盘朝上
+. `编号交错方式` 可以选择:
+* 奇数交错 (奇数引脚靠近器件主体)
+* 偶数交错 (偶数引脚靠近器件主体)
 
-**Size Parameter:**
+**尺寸参数:**
 
-{{< klcimg src="to-body_dim" title="Body dimension details" >}}
+{{< klcimg src="to-body_dim" title="主体尺寸细节" >}}
 
-Orientation:
+安装方向:
 
-{{< klcimg_full_width src="to-THT_orientation" title="TO THT orientation" >}}
\ No newline at end of file
+{{< klcimg_full_width src="to-THT_orientation" title="TO THT 安装方向" >}}
diff --git a/content/footprint/F3/F3.7.adoc b/content/footprint/F3/F3.7.adoc
index 58a4a1c..45b53c5 100644
--- a/content/footprint/F3/F3.7.adoc
+++ b/content/footprint/F3/F3.7.adoc
@@ -1,16 +1,16 @@
 +++
-title = "F3.7 Fuse naming conventions"
+title = "F3.7 保险丝命名参考规范"
 +++
 
 {{< fp_naming_header type="fuse and fuse holder" >}}
 
-== Fuse Holders
+== 保险丝座 Fuse Holders
 
 {{< fp_code name="fuse_holder" >}}
 
-Examples of `Fuse Type` field:
+`保险丝种类` 字段示例:
 
-* Automotive fuses:
+* Automotive fuses 汽车用保险丝:
 ** Automotive-Micro2
 ** Automotive-Micro3
 ** Automotive-LowProfile
@@ -19,15 +19,15 @@ Examples of `Fuse Type` field:
 ** Automotive-Maxi
 ** Automotive-Bosch
 ** Automotive-SFE-[SizeCode]
-* Industrial fuses
+* Industrial fuses 工业用保险丝
 ** Cylinder-[diameter]x[length]mm
 
-== Fuses
+== 保险丝 Fuses
 
-=== Cylindrical Fuse
+=== 圆柱形保险丝 Cylindrical Fuse
 
 {{< fp_code name="fuse" >}}
 
-=== Rectangular SMD Fuses
+=== 矩形 SMD 贴片保险丝 Rectangular SMD Fuses
 
-{{< fp_code name="fuse_smd" >}}
\ No newline at end of file
+{{< fp_code name="fuse_smd" >}}
diff --git a/content/footprint/F3/_index.adoc b/content/footprint/F3/_index.adoc
index b03dee4..01c0354 100644
--- a/content/footprint/F3/_index.adoc
+++ b/content/footprint/F3/_index.adoc
@@ -1,3 +1,3 @@
 ---
-title: F3 Specific Naming Conventions
----
\ No newline at end of file
+title: F3 特定封装命名参考规范
+---
diff --git a/content/footprint/F4/F4.1.adoc b/content/footprint/F4/F4.1.adoc
index 3da1e87..6562c87 100644
--- a/content/footprint/F4/F4.1.adoc
+++ b/content/footprint/F4/F4.1.adoc
@@ -1,9 +1,9 @@
 +++
-title = "F4.1 Datasheet recommendations take priority"
+title = "F4.1 优先参考数据手册"
 +++
 
-Where conflict exists between datasheet recommendations and KLC requirements, then (in the general case) the datasheet should take priority.
+如果数据手册 Datasheet 要求与 KLC 要求之间存在冲突，应优先参考数据手册 Datasheet。
 
-It is important when designing footprints that they adhere to requirements for soldering and assembly - often these requirements have very small tolerance for variation.
+在设计封装时，最重要的事是要遵守焊接和安装的要求。这些要求指数常常非常严格，必须保证非常小的公差。
 
-If the KLC is at odds with the datasheet, follow the datasheet, and note this difference to the KiCad library team when submitting your contribution.
+如果 KLC 与数据手册 Datasheet 不一致，请遵循 Datasheet，并在提交贡献时备注以告知 KiCad 库团队。
diff --git a/content/footprint/F4/F4.2.adoc b/content/footprint/F4/F4.2.adoc
index 4d67c32..85aa159 100644
--- a/content/footprint/F4/F4.2.adoc
+++ b/content/footprint/F4/F4.2.adoc
@@ -1,17 +1,17 @@
 +++
-title = "F4.2 Pin 1 should be located at the top left"
+title = "F4.2 封装 1 号管脚靠近左上放置"
 +++
 
-Footprints should be oriented such that Pin 1 is located in the upper left corner (IPC-7351).
+封装的 1 号管脚应位于封装的左上角 (IPC-7351)。
 
-{{< klcimg src="F4.2" title="Pin 1 aligned top left" >}}
+{{< klcimg src="F4.2" title="Pin 1 位于左上角" >}}
 
-**Exceptions**
+**例外**
 
-Where footprints cannot be oriented with pin 1 in the top-left quadrant, pin 1 should be aligned to the top
+如果把 1 号管脚放在左上角会导致无法定位封装，那么 1 号管脚可以放置在封装顶部
 
-{{< klcimg src="F4.2a" title="Align to top if top-left not possible" >}}
+{{< klcimg src="F4.2a" title="如果左上角放不了，就放在顶部" >}}
 
-Two terminal footprints should be aligned with pin 1 on the left side
+如果是二端元件，1 脚应该放在左边
 
-{{< klcimg src="F4.2b" title="Two terminal footprints align pin 1 on left" >}}
+{{< klcimg src="F4.2b" title="二端元件的 1 脚放在左边" >}}
diff --git a/content/footprint/F4/F4.3.adoc b/content/footprint/F4/F4.3.adoc
index 8f92e0f..c898735 100644
--- a/content/footprint/F4/F4.3.adoc
+++ b/content/footprint/F4/F4.3.adoc
@@ -1,11 +1,11 @@
 +++
-title = "F4.3 Connected copper elements have the same pad number"
+title = "F4.3 相连的铜箔共用焊盘编号"
 +++
 
-Footprints that contain multiple pads or conductive elements that are *physically connected* require special attention:
+包含多个 *物理连接* 的焊盘或导电元件的封装时需要特别注意:
 
-. Multiple pads that are physically connected must share the same number
-. Thermal vias (if present) must share the same number as the thermal pad to which they are connected
+. 物理连接的多个焊盘必须共用同一的编号
+. 散热孔（如果存在）必须与它们所连接的散热焊盘共用同一编号
 
 
-{{< klcimg src="F4.3a" title="Connected copper areas must have same pad number" >}}
\ No newline at end of file
+{{< klcimg src="F4.3a" title="相连的铜箔必须共用同一焊盘编号" >}}
diff --git a/content/footprint/F4/F4.5.adoc b/content/footprint/F4/F4.5.adoc
index a648a80..149c460 100644
--- a/content/footprint/F4/F4.5.adoc
+++ b/content/footprint/F4/F4.5.adoc
@@ -1,13 +1,13 @@
 +++
-title = "F4.5 Specifying footprint keepout areas"
+title = "F4.5 Keepout 区域 (禁止布线层) 绘制的特殊说明"
 +++
 
-KiCad does not yet have a method for drawing keepout areas inside footprint files. Until this feature is implemented, footprint keepout must should be indicated using the following procedure:
+KiCad 还没有在封装文件中绘制 Keepout 层的方法。 在此功能加入之前，必须按照以下步骤绘制表示 Keepout 区域:
 
-. Keepout area shape should be drawn on the `Dwgs.User` layer
-. Area should be hatched diagonally
-. Descriptive text may be included on the `Cmts.User` layer. This text is used to provide further information about keepout requirements to the user.
+. 应在 `Dwgs.User` 层上绘制 Keepout 区域形状
+. 应该使用阴影斜线表示该区域
+. 描述性文本可以被放置在在 `Cmts.User` 层上，此文本用于向用户提供有关 Keepout 区域要求的更多信息
 
-*Example:*
+*示例:*
 
-{{< klcimg src="F4.5" title="Drawing keepout areas" >}}
\ No newline at end of file
+{{< klcimg src="F4.5" title="绘制 Keepout 区域" >}}
diff --git a/content/footprint/F4/_index.adoc b/content/footprint/F4/_index.adoc
index ac1ca63..1e01554 100644
--- a/content/footprint/F4/_index.adoc
+++ b/content/footprint/F4/_index.adoc
@@ -1,3 +1,3 @@
 ---
-title: F4 General Footprint Requirements
----
\ No newline at end of file
+title: F4 封装绘制参考规范
+---
diff --git a/content/footprint/F5/_index.adoc b/content/footprint/F5/_index.adoc
index 85558c3..4ff1846 100644
--- a/content/footprint/F5/_index.adoc
+++ b/content/footprint/F5/_index.adoc
@@ -1,3 +1,3 @@
 ---
-title: F5 Layer Requirements
----
\ No newline at end of file
+title: F5 层绘制要求
+---
-- 
Gitee