1 Star 1 Fork 0

Mike_W / wafer-defect-maps

加入 Gitee
与超过 600 万 开发者一起发现、参与优秀开源项目,私有仓库也完全免费 :)
免费加入
该仓库未指定开源许可证,未经作者的许可,此代码仅用于学习,不能用于其他用途。
克隆/下载
取消
提示: 由于 Git 不支持空文件夾,创建文件夹后会生成空的 .keep 文件
Loading...
README.md

Recognizing Defect Patterns in Wafer Maps

Inspection equipment for the semiconductor industry saves companies millions of dollars. This project uses the MIR-WM811K Corpus» of wafer maps to build a CNN classifier to automate classification of wafer defect patterns.

Table of Contents

  1. About the Project
  2. Data
  3. Project Details
  4. Modeling
  5. Results
Contact

About the Project

Introduction

Many readers may be wondering, what is a wafer map? First, wafers are thin slices of semiconductor material (usually silicon) which serve as a substrate to fabricate microchips ("chips"/"dies") or solar cells. Wafers are circular, per the manufacturing process, and chips are rectangular. A complete wafer with arrays of chips is tested electrically, to find which chips are functional versus faulty. An image can be constructed from these results to show the locations of each chip and their statuses. An example is shown below, where yellow indicates failed chips, and turquoise represents functional chips:

Spatial patterns in wafer maps are useful in determining root causes of these failures, which can save semiconductor manufacturers time and money. In order to automate this pattern recognition process, I built a CNN multi-class classifier to distinguish between 8 classes of failure type.

Built With

Python 3.9:

ML modules:

  • Keras & tensorflow
  • sci-kit learn
  • imblearn

Data modules

  • pandas
  • numpy
  • cv2

Plotting modules

  • matplotlib

Jupyter Notebook

Repository structure

  • img: Figure image files
  • notebooks: Jupyter Notebooks
  • src: Python files

A presentation summarizing the data analysis and results can be found here.

Data

This project explores over 800,000 real wafer maps from the MIR-WM811K Corpus, made public by the MIR Lab at the National Taiwan University:

Project Details

Data Wrangling

The data started in the form of a pickle file, so I converted it to a pandas DataFrame for easier processing. The dimensions of the DataFrame were 811,457 rows by 6 columns. The first column contained the main data, which had entries in the format of 2-D numpy arrays of the wafer maps, with each element labeled as 0, 1, or 2, for failed, functional, and space outside of the wafer. I combined the functional and empty space categories to make the maps binary. Most of the samples were unlabeled, and among the labeled samples, only 25,519 were classified as "failed." I dropped all but these 25,519 rows, under the assumption that each wafer can be flagged ahead of time as failed by applying a simple chip yield threshold.

Next, I dropped the extraneous columns of dieSize, lotName, and waferIndex. The dieSize information is already contained within the wafer map dimensions. The failureType labels were in the form of strings in nested lists, so I converted them using a categorical encoder. I also converted the wafer maps into a form suitable for Keras and tensorflow. The dataset came with training/test set labels, so I separated the data by these.

EDA

First, I explored the wafer maps, by plotting them as images. Below are examples from each failure type:

The failure types have patterns, such as lines for the "scratch" class, and outer rings of failed chips for the "edge-ring" class. I noticed that the dimensions of the maps were not uniform, with variation across and within classes. Dimensions varied in the range of roughly 10x10 to more than 100x100. I resized all of the images to a uniform size, and made the size an adjustable parameter.

Next, I explored the class distributions, and was suprised to find significant class imbalances in the training data:

For instance, "edge-ring" accounted for nearly 50% of the data, and "near-full" (nearly all failed chips) was 0.3% of the data. Additionally, the training and test datasets had different distributions:

This adds challenge to the problem, but also makes it more realistic, since the real-world will not follow the training set distribution. I decided to focus on optimizing the metric of recall, since high accuracy and precision can be obtained by ignoring the underrepresented classes

Modeling

I trained a convolutional neural network (CNN) for this classification project, because it is typical in the application of image recognition. I adapted a simple CNN model used for recognition of the MNIST handwritten digits corpus. A model diagram of this CNN model can be found here. An important feature of the model is the final activation function is a softmax, which is useful for multiclass classification problems because it assigns a probability of each sample belonging to each class

Results

I trained the CNN model by testing ranges of (hyper)parameters including optimizer type, learning rate, number of epochs, batch size, kernel size, and image size. The procedure I followed was to train and evaluate the model with k-fold cross-validation (k=5), which was useful for hyperparameter tuning. Then, I trained the model on the entire training dataset, and evaluated its performance on the test set. I included the metrics of recall, precision and accuracy to be informative, but I only focused on optimizing the recall.

SMOTE Oversampling

Without tuning the parameters, I found that the initial results of testing could use improvement. In particular, the model performed significantly worse on the test set than the validation set. I attempted to address this with SMOTE oversampling, to oversample the underrepresented classes in the training set. This generated synthetic samples using a variation of a k-Nearest Neighbors (k-NN) algorithm. I oversampled until all classes had as many samples as the plurality class, roughly 8,000.

However, once I tested the modeled by training with the SMOTE oversampled data, it resulted in significantly worse recall and accuracy, and marginally improved precision. A comparison is below:

Before SMOTE: Test recall = 0.46

After SMOTE: Test recall = 0.22

Based on this, I scrapped the idea. However, the class imbalance issue could be further explored in the future using techniques such as imbalanced class weights or augmented training data generators.

Final Results

After testing various hyperparameters I settled on the values below, which resulted in the best performance using the metric of recall.

Note that the validation set performs better than the training set, which is not an error, but is likely due to the sensitivity of sampling of the underrepresented classes for training and validation.

Here were the final parameters and results:

While this value can be improved by training longer, using more data, etc., it is an impressive result given the severe class imbalance. CNN models like this have many applications in the inspection equipment subset of the semiconductor manufacturing industry, and companies like KLA-Tencor and Applied Materials have had a recent push to apply data science toward automating quality control processes.

Contact

Author: Christopher Shaffer

Email

Github

仓库评论 ( 0 )

你可以在登录后,发表评论

简介

取消

发行版

暂无发行版

贡献者

全部

近期动态

加载更多
不能加载更多了
1
https://gitee.com/Mike_W/wafer-defect-maps.git
git@gitee.com:Mike_W/wafer-defect-maps.git
Mike_W
wafer-defect-maps
wafer-defect-maps
main

搜索帮助

161121 f78d6d6f 1850385 154831 86f8c370 1850385